Leveling with Step Potential in Damascene Cu Electrodeposition
نویسندگان
چکیده
منابع مشابه
High Reliable Cu Damascene Interconnects with Cu/Ti/TiN/Ti Layered Structure
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ژورنال
عنوان ژورنال: Journal of The Electrochemical Society
سال: 2006
ISSN: 0013-4651
DOI: 10.1149/1.2354459